Selecting a Plating Cell

1. PN: 785 Plating Cell Series:
These plating cells are designed for precision deposit stress measurements. The Polycarbonate Construction Plating Cell (PN: 785A) and PVC Construction plating Cell (PN: 785B for Chromic Acid and harsh chemicals) have flow holes at each end on the bottom sides to allow solution to flow into the cell when the cell is lowered into the plating bath. If it’s desired to use a single plating cell for both in-tank and lab settings, the Polycarbonate Construction Plating Cell with flow holes (PN: 785A or PN: 785B) fits inside the Container (PN: 100) for lab work. For in the lab only use a Polycarbonate Construction Plating Cell (PN: 785C) which has no flow holes on the bottom sides and is a self-contained unit. All plating cells contain a pocket at each end to hold a 2 3/8″ x 2 3/8″ x 1/8″ anode in place and a bracket to hold a test strip in the plating cell.

2. PN: 800 Plating Cell Series:
The 800 Series Plating Cells are self contained units. The plating solution is poured into the cell for use in a laboratory. A dividing wall separates the cells into two equal sections. One section is utilized to heat using the Immersion Heater (PN:3046) and agitate the solution selected for the evaluation of deposit stress using the Submersible Pump (PN: 404 which is included in the purchase of a PN: 800L). The dividing wall has an opening at each end to permit solution flow through both cell sections. All plating cells contain a pocket at each end to hold a 2 3/8″ x 2 3/8″ x 1/8″ anode in place and a bracket to hold a test strip in the plating bath.
*The PN: 800L Cell or PN: 404 Pump is NOT intended to be used with Chromic Acid. For Chromic Acid you would need the plating cell PN: 800PVC.

3. PN: 492 Insite one plating cell:
The In-Site 1 Plating Cell can be used in a solution volume as small as a 400 ml beaker. It is critical, however, to place the cell equal distant from two anodes that are of similar size, shape and composition that are positioned across from the openings in the cell.

4. Harsh chemical exposure:
A PVC plating cell is required when plating with harsh chemical solutions, such as Chromic Acid.

5. Temperature considerations:
Two cell materials are available: Lexan, clear poly carbonate for temperatures up to 212°F, and PVC, poly vinyl chloride for temperatures up to 360°F.

6. Solution agitation:
For most applications, solution agitation is not necessary for the In-Site 1 Cell and for the 785 Series Plating Cells. Use of slight agitation for above room temperature operation is required for the  800 Series Plating Cells to maintain a uniform bath temperature since the heater is located on one side of the working cell. The solution flow must be minimal in the test strip side of the cell so the legs of the test strip are not bent so as to favor one anode above the other, yet sufficient to maintain a uniform bath temperature.
Note: With the purchase of a PN: 800L Plating Cell there is a PN: 404 Submersible Pump included in the price.

7. Bath temperature control.
The heater (PN: 3046) is used to control the bath temperature. Precise temperature control to ± 2°F is attainable with the use of the Electronic Temperature Controller LCD-111000-000, a Class A digital apparatus (PN: 590TC).

8. Test strip and anode considerations see below table:
*Two are required, similar in composition, shape and size.
*Two Anodes 2 3/8″ (61mm) x 2 3/8″ (61mm) (Can be purchased from Kocour Company – contact information is on contact us page).

Test Strip and Anode Considerations

Metallic Deposit Test Strip        Anodes*
Cadium 1194, 270NI Cadium
Chromium 270NI Lead
Cobalt 1194, 270NI Cobalt
Copper 1194, 270NI Copper
Gold 270NI Platinum Coated Titanium
Nickel 1194, 270NI Nickel
Palladium 1194 Platinum Coated Titanium
Platinum 270NI Platinum
Rhodium 270NI Platinum Coated Titanium
>Silver 1194, 270NI Silver
Tin 1194, 270NI Tin
Zinc 1194, 270NI Zinc

*Two Anodes are required, similar in composition, shape and size. Anodes 2x2x1/8″ can be purchased from Kocour Company.

Note: For Electroless Nickel activation is not required for Chemically induced metallic deposition.