The Bent Strip Method (Deposit Stress Analyzer System) is now approved as ASTM Standard B975
The Deposit Stress Analyzer System is comprised of an economical, disposable Test Strip, PN: 785 Plating Cell, and PN: 683 Test Stand. The Test Strip has a small surface area and can be plated in the work tank or in a laboratory setting using the Plating Cell. The Plating Cell offers standard anode to cathode spacing to insure uniform current density across the Test Strip’s legs. After plating, the Test Strip is supported in the Testing Stand which measures the distance that the Test Strip’s legs have spread. The distance is included in a formula to calculate the deposit stress in pounds per square inch. Stress is also determined to be compressive or tensile in nature. Small permanently mountable plating cells are also available to place in working tanks.
The Deposit Stress Analyzer System can be used by all metal platers. Some applications include:
- Military zinc, tin and cadmium plated deposits.
- Hard chrome plated deposits.
- Decorative nickel chrome plated deposits.
- Electronics copper and nickel plated deposits.
- Electroformed copper and nickel deposits.
- Precious metal plated deposits.
- Electroless chemically deposited metallic layers.
- Engineered metal alloy plated deposits.
The Deposit Stress Analyzer supports a plated Test Strip over a scale so the number of scale increments between the tips of the test piece can be read. The increment reading is then included in a formula to calculate the internal deposit stress in pounds per square inch. If the Test Strip’s legs are spread outward on the side that has been plated, plated side out and resist side in, the deposit stress is tensile in nature. If the Test Strip’s legs are spread inward on the side that has been plated, the deposit stress is compressive in nature.