The PN: 1194 copper test strips are .002 inch thick and the PN: 270NI test strips are .0011 inch thick. The thinner the test strip material makes them more sensitive to determine low stress. Note: Avoid storing Test Strips under UV lighting. This can over time crack the resist on the test strip causing it to break or peel during plating which will produce inaccurate results.
Total Test Strip legs units spread should not exceed 20 units total. If this happens reduce the deposition time and the deposit thickness to improve the accuracy. The Deposit Stress Analyzer scale has larger spaces between the lower numbers and the spaces get smaller on the higher numbers. If your numbers are low you can estimate the spread between numbers a litter easier than if the numbers are higher. When the numbers get higher than 10 total units you might not need to estimate more than 0.5
The Test Strip Resist parameters….Really depends on the solution’s pH
Since water boils at 212 Degrees F that is the max temperature any aqueous plating solution can at achieve.
A) Resist was designed for pH’s 0-7 at 160 Degrees F
B) Resist will hold up for a short time above a pH of 7 -12 ~ 1-10 minutes. at 120 Degrees F
C) They are baked at 175 Degrees F during manufacturing
This an organic resin and anything over ~ 350 degrees F will NOT WORK
Copper Test Strips will tarnish if kept in humid conditions. To clean the test strip follow the cleaning procedure for preparing the test strips, which is Soak a test strip in a soak cleaner solutions at 110-120 degrees F. for up to 30 seconds, water rinse. Then immerse in a 10% by volume hydrochloric acid solution for 15 seconds at room temperature then water rinse. If the resist is not adhering well to the test strip reduce the cleaning time slightly.
When plating the test strip in tank along with parts please note the test strip time may be different than the part plating times. The recommended thickness for the most accurate test is 100 Microinches.